Datasheet Texas Instruments AM3715 — Datenblatt

Hersteller	Texas Instruments
Serie	AM3715

Datenblätter

Preise

Status

Verpackung

Parameter

Parameters / Models	AM3715CBC	AM3715CBC100	AM3715CBCD100	AM3715CBP	AM3715CBP100	AM3715CBPA	AM3715CBPD100	AM3715CUS	AM3715CUS100	AM3715CUSA	AM3715CUSD100
ARM CPU	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8	1 ARM Cortex-A8
ARM MHz, Max.	1000	1000	1000	1000	1000	1000	1000	1000	1000	1000	1000
Applications	Industrial,Personal Electronics	Industrial,Personal Electronics	Industrial,Personal Electronics	Industrial,Personal Electronics	Industrial,Personal Electronics	Industrial,Personal Electronics	Industrial,Personal Electronics	Industrial,Personal Electronics	Industrial,Personal Electronics	Industrial,Personal Electronics	Industrial,Personal Electronics
DRAM	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR	LPDDR
Display Options	DSS	DSS	DSS	DSS	DSS	DSS	DSS	DSS	DSS	DSS	DSS
Graphics Acceleration	1 3D	1 3D	1 3D	1 3D	1 3D	1 3D	1 3D	1 3D	1 3D	1 3D	1 3D
I2C	4	4	4	4	4	4	4	4	4	4	4
On-Chip L2 Cache	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)	256 KB (ARM Cortex-A8)
Operating Systems	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE
Operating Temperature Range, C	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90	-40 to 105,-40 to 90,0 to 90
Other On-Chip Memory	64 KB	64 KB	64 KB	64 KB	64 KB	64 KB	64 KB	64 KB	64 KB	64 KB	64 KB
Rating	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog
SPI	4	4	4	4	4	4	4	4	4	4	4
UART, SCI	4	4	4	4	4	4	4	4	4	4	4
USB	4	4	4	4	4	4	4	4	4	4	4
Video Port, Configurable	1 Input,1 Output	1 Input,1 Output	1 Input,1 Output	1 Input,1 Output	1 Input,1 Output	1 Input,1 Output	1 Input,1 Output	1 Input,1 Output	1 Input,1 Output	1 Input,1 Output	1 Input,1 Output

Öko-Plan

Anwendungshinweise

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  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM3715/03_SDRC_SubsystemThe SDRC subsystem module provides connectivity between the AM37x and SDRAM memory components. The module incl
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  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM/DM37x_Overview.This document provides an overview of the AM37x applications processor.All trademarks are property of their respective
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  AM3715/03 Memory Subsystem
  PDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM3715/03_Memory_SubsystemThe Memory Subsystem in the AM3715/03 devices consists of the internal SRAM and two dedicated memory contr
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  AM37x/DM37x Schematic Checklist
  PDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x/DM37x_Schematic_Checklist.This article provides many tips related to reset, JTAG, peripherals, etc. It should be used as
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  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x_EVM_Software_Developer%27s_Guide.This wiki article illustrates the various software components provided with the A
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  PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs
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  The purpose of a power distribution network (PDN) is to provide clean and reliable power to active devices in the system. The printed circuit board (PCB) is a critical component of the system-level PDN. Therefore, the PCB design is of utmost importance for high-performance low-power microprocessors. This application report provides design requirements and details a step-by-step methodology on how
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  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

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  PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors Part II
  PDF, 1.2 Mb, Datei veröffentlicht: Jun 23, 2010
  Once the main printed circuit board (PCB) has been designed the assembly guidelines for the 0.5mm package-on-package (PoP) applications processor and companion memory device must be considered. PoP applications processors have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of PCB assembly: PoP applications process

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