Datasheet Texas Instruments 74ACT11373DW — Datenblatt

Hersteller	Texas Instruments
Serie	74ACT11373
Artikelnummer	74ACT11373DW

Oktale transparente D-Typ-Latches mit 3-Zustands-Ausgängen 24-SOIC -40 bis 85

Datenblätter

Herunterladen

PDF, 848 Kb, Revision: B, Datei veröffentlicht: Apr 1, 1996

Auszug aus dem Dokument

Preise

Status

Lifecycle Status	Active (Recommended for new designs)
Manufacture's Sample Availability	No

Verpackung

Pin	24
Package Type	DW
Industry STD Term	SOIC
JEDEC Code	R-PDSO-G
Package QTY	25
Carrier	TUBE
Device Marking	ACT11373
Width (mm)	7.5
Length (mm)	15.4
Thickness (mm)	2.35
Pitch (mm)	1.27
Max Height (mm)	2.65
Mechanical Data	Herunterladen

Parameter

3-State Output	Yes
Bits	8
F @ Nom Voltage(Max)	90 Mhz
ICC @ Nom Voltage(Max)	0.08 mA
Operating Temperature Range	-40 to 85 C
Output Drive (IOL/IOH)(Max)	24/-24 mA
Package Group	SOIC
Package Size: mm2:W x L	24SOIC: 160 mm2: 10.3 x 15.5(SOIC) PKG
Rating	Catalog
Schmitt Trigger	No
Technology Family	ACT
VCC(Max)	5.5 V
VCC(Min)	4.5 V
Voltage(Nom)	5 V
tpd @ Nom Voltage(Max)	11.8 ns

Öko-Plan

RoHS

Compliant

Anwendungshinweise

Herunterladen
Selecting the Right Level Translation Solution (Rev. A)
PDF, 313 Kb, Revision: A, Datei veröffentlicht: Jun 22, 2004
Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
Herunterladen
TI IBIS File Creation Validation and Distribution Processes
PDF, 380 Kb, Datei veröffentlicht: Aug 29, 2002
The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
Herunterladen
Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
PDF, 614 Kb, Revision: C, Datei veröffentlicht: Dec 2, 2015
Herunterladen
Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
PDF, 337 Kb, Datei veröffentlicht: Jul 8, 2004
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
Herunterladen
Introduction to Logic
PDF, 93 Kb, Datei veröffentlicht: Apr 30, 2015
Herunterladen
Implications of Slow or Floating CMOS Inputs (Rev. D)
PDF, 260 Kb, Revision: D, Datei veröffentlicht: Jun 23, 2016
Herunterladen
CMOS Power Consumption and CPD Calculation (Rev. B)
PDF, 89 Kb, Revision: B, Datei veröffentlicht: Jun 1, 1997
Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
Herunterladen
Power-Up Behavior of Clocked Devices (Rev. A)
PDF, 34 Kb, Revision: A, Datei veröffentlicht: Feb 6, 2015
Herunterladen
Designing With Logic (Rev. C)
PDF, 186 Kb, Revision: C, Datei veröffentlicht: Jun 1, 1997
Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
Herunterladen
Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
PDF, 43 Kb, Datei veröffentlicht: Apr 1, 1996
Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren

Modellreihe

Serie: 74ACT11373 (4)

74ACT11373DBR 74ACT11373DW 74ACT11373DWG4 74ACT11373DWR

Herstellerklassifikation

Semiconductors > Logic > Flip-Flop/Latch/Register > D-Type Latch