Datasheet Texas Instruments 66AK2H14 — Datenblatt
Hersteller | Texas Instruments |
Serie | 66AK2H14 |
Multicore DSP + ARM KeyStone II System-on-Chip (SoC)
Datenblätter
66AK2Hxx Multicore DSP+ARMВ® KeyStone II System-on-Chip (SoC) datasheet
PDF, 2.4 Mb, Revision: F, Datei veröffentlicht: Jun 2, 2017
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Status
66AK2H14BAAW24 | 66AK2H14BAAWA24 | 66AK2H14BXAAW24 | 66AK2H14DAAW24 | 66AK2H14DAAWA24 | 66AK2H14DXAAWA24 | |
---|---|---|---|---|---|---|
Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
Manufacture's Sample Availability | No | No | Yes | No | No | No |
Verpackung
66AK2H14BAAW24 | 66AK2H14BAAWA24 | 66AK2H14BXAAW24 | 66AK2H14DAAW24 | 66AK2H14DAAWA24 | 66AK2H14DXAAWA24 | |
---|---|---|---|---|---|---|
N | 1 | 2 | 3 | 4 | 5 | 6 |
Pin | 1517 | 1517 | 1517 | 1517 | 1517 | 1517 |
Package Type | AAW | AAW | AAW | AAW | AAW | AAW |
Package QTY | 21 | 21 | 21 | 21 | 21 | 1 |
Carrier | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | |
Device Marking | 66AK2H14AAW | A1.2GHZ/1.4GHZ | 1.2GHZ/1.4GHZ | 1.2GHZ/1.4GHZ | A1.2GHZ/1.4GHZ | @2012 TI |
Width (mm) | 40 | 40 | 40 | 40 | 40 | 40 |
Length (mm) | 40 | 40 | 40 | 40 | 40 | 40 |
Thickness (mm) | 3.07 | 3.07 | 3.07 | 3.07 | 3.07 | 3.07 |
Mechanical Data | Herunterladen | Herunterladen | Herunterladen | Herunterladen | Herunterladen | Herunterladen |
Parameter
Parameters / Models | 66AK2H14BAAW24 | 66AK2H14BAAWA24 | 66AK2H14BXAAW24 | 66AK2H14DAAW24 | 66AK2H14DAAWA24 | 66AK2H14DXAAWA24 |
---|---|---|---|---|---|---|
ARM CPU | 4 ARM Cortex-A15 | 4 ARM Cortex-A15 | 4 ARM Cortex-A15 | 4 ARM Cortex-A15 | 4 ARM Cortex-A15 | 4 ARM Cortex-A15 |
ARM MHz, Max. | 1200,1400 | 1200,1400 | 1200,1400 | 1200,1400 | 1200,1400 | 1200,1400 |
Applications | Automation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space | Automation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space | Automation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space | Automation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space | Automation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space | Automation and Process,Avionics and Defense,Communications and Telecom,Consumer Electronics,Industrial,Medical,Security,Space |
DRAM | DDR3,DDR3L | DDR3,DDR3L | DDR3,DDR3L | DDR3,DDR3L | DDR3,DDR3L | DDR3,DDR3L |
DSP | 8 C66x | 8 C66x | 8 C66x | 8 C66x | 8 C66x | 8 C66x |
DSP MHz, Max. | 1200 | 1200 | 1200 | 1200 | 1200 | 1200 |
EMAC | 10G Ethernet | 10G Ethernet | 10G Ethernet | 10G Ethernet | 10G Ethernet | 10G Ethernet |
Hardware Accelerators | Packet Accelerator,Security Accelerator | Packet Accelerator,Security Accelerator | Packet Accelerator,Security Accelerator | Packet Accelerator,Security Accelerator | Packet Accelerator,Security Accelerator | Packet Accelerator,Security Accelerator |
I2C | 3 | 3 | 3 | 3 | 3 | 3 |
On-Chip L2 Cache | 4096 KB (ARM Cluster),1024 KB (per C66x DSP core) | 4096 KB (ARM Cluster),1024 KB (per C66x DSP core) | 4096 KB (ARM Cluster),1024 KB (per C66x DSP core) | 4096 KB (ARM Cluster),1024 KB (per C66x DSP core) | 4096 KB (ARM Cluster),1024 KB (per C66x DSP core) | 4096 KB (ARM Cluster),1024 KB (per C66x DSP core) |
Operating Systems | Integrity,Linux,SYS/BIOS,VxWorks | Integrity,Linux,SYS/BIOS,VxWorks | Integrity,Linux,SYS/BIOS,VxWorks | Integrity,Linux,SYS/BIOS,VxWorks | Integrity,Linux,SYS/BIOS,VxWorks | Integrity,Linux,SYS/BIOS,VxWorks |
Operating Temperature Range, C | -40 to 100,0 to 85 | -40 to 100,0 to 85 | -40 to 100,0 to 85 | -40 to 100,0 to 85 | -40 to 100,0 to 85 | -40 to 100,0 to 85 |
Other On-Chip Memory | 6144 KB | 6144 KB | 6144 KB | 6144 KB | 6144 KB | 6144 KB |
PCI/PCIe | 2 PCIe Gen2 | 2 PCIe Gen2 | 2 PCIe Gen2 | 2 PCIe Gen2 | 2 PCIe Gen2 | 2 PCIe Gen2 |
Rating | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog |
SPI | 3 | 3 | 3 | 3 | 3 | 3 |
UART, SCI | 2 | 2 | 2 | 2 | 2 | 2 |
USB | 1 | 1 | 1 | 1 | 1 | 1 |
Öko-Plan
66AK2H14BAAW24 | 66AK2H14BAAWA24 | 66AK2H14BXAAW24 | 66AK2H14DAAW24 | 66AK2H14DAAWA24 | 66AK2H14DXAAWA24 | |
---|---|---|---|---|---|---|
RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Anwendungshinweise
- PCI Express (PCIe) Resource Wiki for Keystone Devices (Rev. A)PDF, 57 Kb, Revision: A, Datei veröffentlicht: May 19, 2017
- Keystone II DDR3 InitializationPDF, 73 Kb, Datei veröffentlicht: Jan 26, 2015
This application report provides a step-to-step initialization guide for the Keystone II device DDR3 SDRAM controller. - Throughput Performance Guide for KeyStone II Devices (Rev. B)PDF, 866 Kb, Revision: B, Datei veröffentlicht: Dec 22, 2015
This application report analyzes various performance measurements of the KeyStone II family of processors. It provides a throughput analysis of the various support peripherals to different end-points and memory access. - Keystone II DDR3 Debug GuidePDF, 143 Kb, Datei veröffentlicht: Oct 16, 2015
This guide provides tools for use when debugging a failing DDR3 interface on a KeyStone II device. - Power Management of KS2 Device (Rev. C)PDF, 61 Kb, Revision: C, Datei veröffentlicht: Jul 15, 2016
This application report lists the steps to enable Class 0 Temperature Compensation (Class 0 TC) mode of SmartReflexв„ў Subsystem (SRSS) module available on such devices. - Hardware Design Guide for KeyStone II DevicesPDF, 1.8 Mb, Datei veröffentlicht: Mar 24, 2014
- SERDES Link Commissioning on KeyStone I and II DevicesPDF, 138 Kb, Datei veröffentlicht: Apr 13, 2016
The serializer-deserializer (SerDes) performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial conversion on data received from the CPU. This application report explains the SerDes transmit and receive parameters tuning, tools and some debug techniques for TI Keystone I and Keystone II devices. - PCIe Use Cases for KeyStone DevicesPDF, 320 Kb, Datei veröffentlicht: Dec 13, 2011
- The C6000 Embedded Application Binary Interface Migration Guide (Rev. A)PDF, 20 Kb, Revision: A, Datei veröffentlicht: Nov 10, 2010
The C6000 compiler tools support a new ELF-based ABI named EABI. Prior to this time, the compiler only supported a single ABI, which is now named COFF ABI. The following compelling best-in-class features are available under the C6000 EABI:GeneralZero-init globals: “int gvar;” gets set to 0 before main runs.Dynamic linking: Add code to a running system.Native ROM - Clocking Design Guide for KeyStone DevicesPDF, 1.5 Mb, Datei veröffentlicht: Nov 9, 2010
- Optimizing Loops on the C66x DSPPDF, 585 Kb, Datei veröffentlicht: Nov 9, 2010
- DDR3 Design Requirements for KeyStone Devices (Rev. B)PDF, 582 Kb, Revision: B, Datei veröffentlicht: Jun 5, 2014
- Multicore Programming Guide (Rev. B)PDF, 1.8 Mb, Revision: B, Datei veröffentlicht: Aug 29, 2012
As application complexity continues to grow, we have reached a limit on increasing performance by merely scaling clock speed. To meet the ever-increasing processing demand, modern System-On-Chip solutions contain multiple processing cores. The dilemma is how to map applications to multicore devices. In this paper, we present a programming methodology for converting applications to run on multicore - TI DSP BenchmarkingPDF, 62 Kb, Datei veröffentlicht: Jan 13, 2016
This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms. - Thermal Design Guide for DSP and ARM Application Processors (Rev. A)PDF, 324 Kb, Revision: A, Datei veröffentlicht: Aug 17, 2016
This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
Modellreihe
Serie: 66AK2H14 (6)
Herstellerklassifikation
- Semiconductors> Processors> Digital Signal Processors> C6000 DSP + ARM Processors> 66AK2x