Datasheet Texas Instruments X66AK2G01ZBB60 — Datenblatt

Hersteller	Texas Instruments
Serie	66AK2G01
Artikelnummer	X66AK2G01ZBB60

Multicore DSP + ARM KeyStone II System-on-Chip (SoC) 625-NFBGA 0 bis 70

Datenblätter

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PDF, 2.6 Mb, Revision: E, Datei veröffentlicht: Jun 8, 2017

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Preise

Status

Lifecycle Status	Active (Recommended for new designs)
Manufacture's Sample Availability	Yes

Verpackung

Pin	625
Package Type	ZBB
Package QTY	1
Carrier	JEDEC TRAY (5+1)
Width (mm)	21
Length (mm)	21
Thickness (mm)	1.16
Mechanical Data	Herunterladen

Parameter

ARM CPU	1 ARM Cortex-A15
ARM MHz	600 Max.
Applications	Communications and Telecom,Consumer Electronics,Industrial,Test and Measurement
DRAM	DDR3L
DSP	1 C66x
DSP MHz	600 Max.
EMAC	1-port 1Gb
Hardware Accelerators	Security Accelerator
I2C	3
On-Chip L2 Cache	512KB w/ECC ARM Cortex-A15,1024KB w/ECC C66x DSP
Operating Systems	Linux,TI-RTOS
Operating Temperature Range	0 to 70 C
Other On-Chip Memory	1024KB w/ECC
Rating	Catalog
SPI	4
UART	3 SCI
USB	1

Öko-Plan

RoHS	See ti.com

Design Kits und Evaluierungsmodule

Daughter Cards: AUDK2G
66AK2Gx (K2G) Audio Daughter Card
Lifecycle Status: Active (Recommended for new designs)
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Evaluation Modules & Boards: EVMK2G
66AK2Gx (K2G) Evaluation Module
Lifecycle Status: Active (Recommended for new designs)

Anwendungshinweise

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66AK2G02 Power Estimation Tool
PDF, 27 Kb, Datei veröffentlicht: Jun 15, 2017
This power estimation spreadsheet provides power consumption estimates based on measured and simulated data; they are provided вЂњas isвЂќ and are not ensured within a specified precision. Power consumption depends on electrical parameters, silicon process variations, environmental conditions, and use cases running on the processor during operation. Actual power consumption should be verified in the r
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Hardware Design Guide for KeyStone II Devices
PDF, 1.8 Mb, Datei veröffentlicht: Mar 24, 2014
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SERDES Link Commissioning on KeyStone I and II Devices
PDF, 138 Kb, Datei veröffentlicht: Apr 13, 2016
The serializer-deserializer (SerDes) performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial conversion on data received from the CPU. This application report explains the SerDes transmit and receive parameters tuning, tools and some debug techniques for TI Keystone I and Keystone II devices.
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DDR3 Design Requirements for KeyStone Devices (Rev. B)
PDF, 582 Kb, Revision: B, Datei veröffentlicht: Jun 5, 2014
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Processor SDK RTOS Audio Benchmark Starter Kit
PDF, 530 Kb, Datei veröffentlicht: Apr 12, 2017
The TI TMS320C6000в„ў Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications that are commonly used in audio processing application. This application notes describes Audio Benchmark Starterkit software that is intended to provide an easy and quick way to benchmark key audio functions on C66x and C674x DSP device
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PRU-ICSS Feature Comparison
PDF, 29 Kb, Datei veröffentlicht: Jun 5, 2017
This application report documents the feature differences between the PRU subsystems available on different TI processors.
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TI DSP Benchmarking
PDF, 62 Kb, Datei veröffentlicht: Jan 13, 2016
This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.
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High-Speed Interface Layout Guidelines (Rev. G)
PDF, 814 Kb, Revision: G, Datei veröffentlicht: Jul 27, 2017
As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

Modellreihe

Serie: 66AK2G01 (1)

X66AK2G01ZBB60

Herstellerklassifikation

Semiconductors > Processors > Digital Signal Processors > C6000 DSP + ARM Processors > 66AK2x