10-Bit-Puffer / Treiber mit Serienwiderstand 24-CDIP -55 bis 125
PDF, 1.7 Mb, Datei veröffentlicht: Oct 1, 1996
This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
PDF, 380 Kb, Datei veröffentlicht: Aug 29, 2002
The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
PDF, 150 Kb, Datei veröffentlicht: Oct 1, 1996
Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
PDF, 105 Kb, Revision: A, Datei veröffentlicht: Aug 1, 1997
The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
PDF, 614 Kb, Revision: C, Datei veröffentlicht: Dec 2, 2015
PDF, 337 Kb, Datei veröffentlicht: Jul 8, 2004
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
PDF, 186 Kb, Revision: C, Datei veröffentlicht: Jun 1, 1997
Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
PDF, 93 Kb, Datei veröffentlicht: Apr 30, 2015
PDF, 260 Kb, Revision: D, Datei veröffentlicht: Jun 23, 2016
