Datasheet Texas Instruments TPS54020RUWT — Datenblatt

HerstellerTexas Instruments
SerieTPS54020
ArtikelnummerTPS54020RUWT
Datasheet Texas Instruments TPS54020RUWT

4,5 V bis 17 V Eingang, 10 A synchroner SWIFT ™ -Konverter mit phasenverschobener Synchronisation 15-VQFN-HR -40 bis 150

Datenblätter

TPS54020 Small, 10-A, 4.5-V to 17-V Input, SWIFTв„ў Synchronous Step-Down Converter With Light-Load Efficiency datasheet
PDF, 2.3 Mb, Revision: D, Datei veröffentlicht: Dec 12, 2014
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Preise

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

Verpackung

Pin15
Package TypeRUW
Industry STD TermVQFN-HR
JEDEC CodeS-PQFP-N
Package QTY250
CarrierSMALL T&R
Device Marking54020
Width (mm)3.5
Length (mm)3.5
Thickness (mm).9
Pitch (mm).5
Max Height (mm)1
Mechanical DataHerunterladen

Parameter

Control ModeCurrent Mode
Duty Cycle(Max)98 %
Iout(Max)10 A
Iq(Typ)0.6 mA
Operating Temperature Range-40 to 150 C
Package GroupVQFN-HR
RatingCatalog
Regulated Outputs1
Special FeaturesAdjustable Current Limit,Enable,Frequency Synchronization,Light Load Efficiency,Phase Interleaving,Power Good,Pre-Bias Start-Up,Synchronous Rectification,Tracking
Switching Frequency(Max)1200 kHz
Switching Frequency(Min)200 kHz
TypeConverter
Vin(Max)17 V
Vin(Min)4.5 V
Vout(Max)5 V
Vout(Min)0.6 V

Öko-Plan

RoHSCompliant
Pb FreeYes

Design Kits und Evaluierungsmodule

  • Evaluation Modules & Boards: TPS54020EVM-082
    10A Synchronous Step-Down SWIFTВ™ Converter Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)

Anwendungshinweise

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    HotRod Quad flatpack No Leads (QFN) are leadless packages specifically designed for power applications. The small footprint, standard QFN pitch, low parasitics along with high current capability of these packages are ideal for power converters application. The electrical connections are made via lands on the bottom side of the component to the surface of the connecting substrate (PCB). This applic
  • Calculating Efficiency
    PDF, 175 Kb, Datei veröffentlicht: Feb 19, 2010
    This application report provides a step-by-step procedure for calculating buck converter efficiency and power dissipation at operating points not provided by the data sheet.
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  • Understanding Thermal Dissipation and Design of a Heatsink
    PDF, 59 Kb, Datei veröffentlicht: May 4, 2011
    Power dissipation performance must be well understood prior to integrating devices on a printed-circuit board (PCB) to ensure that any given device is operated within its defined temperature limits. When a device is running, it consumes electrical energy that is transformed into heat. Most of the heat is typically generated by switching devices like MOSFETs, ICs, etc. This application report discu
  • Semiconductor and IC Package Thermal Metrics (Rev. C)
    PDF, 201 Kb, Revision: C, Datei veröffentlicht: Apr 19, 2016

Modellreihe

Serie: TPS54020 (2)

Herstellerklassifikation

  • Semiconductors > Power Management > Non-isolated DC/DC Switching Regulator > Step-Down (Buck) > Buck Converter (Integrated Switch)