Datasheet Texas Instruments DM3730CUS100NEP — Datenblatt

Hersteller	Texas Instruments
Serie	DM3730
Artikelnummer	DM3730CUS100NEP

Datenblätter

Preise

Status

Verpackung

Parameter

Öko-Plan

Design Kits und Evaluierungsmodule

• Evaluation Modules & Boards: TMDSEVM3730
  AM/DM37x Evaluation Module
  Lifecycle Status: Active (Recommended for new designs)
  
• Evaluation Modules & Boards: BEAGLEXM
  BeagleBoard-xM Development Board
  Lifecycle Status: Obsolete (Manufacturer has discontinued the production of the device)
  

Anwendungshinweise

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  TI OMAP4430 POP SMT Design Guideline (Rev. C)
  PDF, 3.2 Mb, Revision: C, Datei veröffentlicht: Nov 3, 2011
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  AM3715 GPMC
  PDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:href=http://processors.wiki.ti.com/index.php/Am3715_gpmcThe GPMC is a 16-bit external memory controller. The GPMC data access engine provides a flexible programming model for communicatio
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  PCB Design Req for Dist. Network for TI OMAP3630, AM37xx, and DM37xx MCUs
  PDF, 739 Kb, Datei veröffentlicht: Jun 15, 2011
  The purpose of a power distribution network (PDN) is to provide clean and reliable power to active devices in the system. The printed circuit board (PCB) is a critical component of the system-level PDN. Therefore, the PCB design is of utmost importance for high-performance low-power microprocessors. This application report provides design requirements and details a step-by-step methodology on how
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  AM37x/DM37x Schematic Checklist
  PDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x/DM37x_Schematic_Checklist.This article provides many tips related to reset, JTAG, peripherals, etc. It should be used as
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  AM37x EVM Software Developer's Guide
  PDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x_EVM_Software_Developer%27s_Guide.This wiki article illustrates the various software components provided with the A
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  AM/DM37x Overview
  PDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM/DM37x_Overview.This document provides an overview of the AM37x applications processor.All trademarks are property of their respective
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  AM/DM37x Power Estimation Spreadsheet
  PDF, 20 Kb, Datei veröffentlicht: Jun 7, 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or tocontribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM/DM37x_Power_Estimation_SpreadsheetThis article discusses the power consumption of the Texas Instruments AM/DM37x high
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  Ethernet Connectivity via GPMC
  PDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/Ethernet_Connectivity_via_GPMCThe purpose of this article is to describe a solution for connecting Ethernet to various devices,
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  Setting up AM37x SDRC Registers
  PDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/Setting_up_AM37x_SDRC_registersThis wiki article describes how to set the SDRC registers in the OMAP35x SDRC module depending o
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  AM37x CUS Routing Guidelines
  PDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM37x_CUS_Routing_Guidelines.CUS package is designed with a new technology called Via Channelв„ў array. This technology allows for e
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  AM3715/03 Memory Subsystem
  PDF, 19 Kb, Datei veröffentlicht: Jun 3, 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/AM3715/03_Memory_SubsystemThe Memory Subsystem in the AM3715/03 devices consists of the internal SRAM and two dedicated memory contr
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  AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)
  PDF, 2.2 Mb, Revision: A, Datei veröffentlicht: May 1, 2004
  Application Note 1281 Bumped Die (Flip Chip) Packages
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  PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages Part II (Rev. A)
  PDF, 2.4 Mb, Revision: A, Datei veröffentlicht: Nov 1, 2013
  Once the bottom circuit board has been designed the assembly guidelines for package-on-package (PoP) versions of the OMAP35xx processor and the memory device must be considered.

  PoP packages have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of final assembly: the circuit board design the solder paste char

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  PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages Part I (Rev. B)
  PDF, 6.7 Mb, Revision: B, Datei veröffentlicht: Jun 13, 2009
  Ball grid array (BGA) packages having 0.4mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies; the standard rules of thumb don't apply anymore. In fact the design guidelines for 0.4mm and 0.5mm differ primarily due to issues surrounding shorts or opens between balls under the processor.In addition to the de
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  PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors Part II
  PDF, 1.2 Mb, Datei veröffentlicht: Jun 23, 2010
  Once the main printed circuit board (PCB) has been designed the assembly guidelines for the 0.5mm package-on-package (PoP) applications processor and companion memory device must be considered. PoP applications processors have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of PCB assembly: PoP applications process
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  PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors Part I
  PDF, 2.0 Mb, Datei veröffentlicht: Jun 23, 2010
  Ball grid array (BGA) packages having 0.5mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies. PCBs with package-on-package (PoP) technology have additional assembly requirements and options that need to be considered when designing the PCB.

  Fine-pitch PCB design is a team effort and may require more than

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  0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)
  PDF, 40.5 Mb, Revision: A, Datei veröffentlicht: Aug 9, 2015
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  Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
  PDF, 1.6 Mb, Revision: B, Datei veröffentlicht: Aug 13, 2015
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  Introduction to TMS320C6000 DSP Optimization
  PDF, 535 Kb, Datei veröffentlicht: Oct 6, 2011
  The TMS320C6000™ Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications. However to fully leverage the architectural features that C6000™ processors offer code optimization may be required. First this document reviews five key concepts in understanding the C6000 DSP architecture and optimization. Then

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