Datasheet Texas Instruments 5962-9224701M3A — Datenblatt

Datenblätter

Preise

Status

Verpackung

Öko-Plan

Anwendungshinweise

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  Selecting the Right Level Translation Solution (Rev. A)
  PDF, 313 Kb, Revision: A, Datei veröffentlicht: Jun 22, 2004
  Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
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  Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
  PDF, 337 Kb, Datei veröffentlicht: Jul 8, 2004
  Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
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  Introduction to Logic
  PDF, 93 Kb, Datei veröffentlicht: Apr 30, 2015
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  Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
  PDF, 614 Kb, Revision: C, Datei veröffentlicht: Dec 2, 2015

Modellreihe

Herstellerklassifikation

• Semiconductors > Space & High Reliability > Logic Products > Buffers/Drivers/Transceivers > Buffer Drivers

Andere Namen:

59629224701M3A, 5962 9224701M3A