Datasheet Texas Instruments 5962-8761101DA — Datenblatt

HerstellerTexas Instruments
SerieSN54AC11
Artikelnummer5962-8761101DA
Datasheet Texas Instruments 5962-8761101DA

Dreifache positive UND-Gatter mit 3 Eingängen 14-CFP -55 bis 125

Datenblätter

SN54AC11, SN74AC11 datasheet
PDF, 1.2 Mb, Revision: D, Datei veröffentlicht: Oct 23, 2003
Auszug aus dem Dokument

Preise

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

Verpackung

Pin14
Package TypeW
Industry STD TermCFP
JEDEC CodeR-GDFP-F
Package QTY1
CarrierTUBE
Width (mm)5.97
Length (mm)9.21
Thickness (mm)1.59
Pitch (mm)1.27
Max Height (mm)2.03
Mechanical DataHerunterladen

Parameter

Bits3
F @ Nom Voltage(Max)100 Mhz
ICC @ Nom Voltage(Max)0.02 mA
Input TypeCMOS
Operating Temperature Range-55 to 125 C
Output Drive (IOL/IOH)(Max)-24/24 mA
Output TypeCMOS
Package GroupCFP
Package Size: mm2:W x LSee datasheet (CFP) PKG
RatingMilitary
Schmitt TriggerNo
Technology FamilyAC
VCC(Max)6 V
VCC(Min)2 V
tpd @ Nom Voltage(Max)10,8.5 ns

Öko-Plan

RoHSSee ti.com

Anwendungshinweise

  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, Datei veröffentlicht: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Introduction to Logic
    PDF, 93 Kb, Datei veröffentlicht: Apr 30, 2015
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revision: C, Datei veröffentlicht: Dec 2, 2015
  • Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
    PDF, 43 Kb, Datei veröffentlicht: Apr 1, 1996
    Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren
  • Live Insertion
    PDF, 150 Kb, Datei veröffentlicht: Oct 1, 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, Datei veröffentlicht: Oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, Revision: C, Datei veröffentlicht: Jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Kb, Revision: B, Datei veröffentlicht: Jun 1, 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Kb, Revision: D, Datei veröffentlicht: Jun 23, 2016
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, Datei veröffentlicht: Aug 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con

Modellreihe

Herstellerklassifikation

  • Semiconductors > Space & High Reliability > Logic Products > Gate Products

Andere Namen:

59628761101DA, 5962 8761101DA