Datasheet Texas Instruments 74AVC4T774RGYRG4 — Datenblatt

HerstellerTexas Instruments
SerieSN74AVC4T774
Artikelnummer74AVC4T774RGYRG4
Datasheet Texas Instruments 74AVC4T774RGYRG4

4-Bit-Dual-Supply-Bus-Transceiver mit konfigurierbarer Spannungspegelverschiebung und 3-Zustands-Ausgängen 16-VQFN -40 bis 85

Datenblätter

SN74AVC4T774 4-Bit Dual-Supply Bus Transceiver With Configurable Voltage Translation and 3-State Outputs datasheet
PDF, 1.2 Mb, Revision: D, Datei veröffentlicht: Jan 20, 2015
Auszug aus dem Dokument

Preise

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityYes

Verpackung

Pin16
Package TypeRGY
Industry STD TermVQFN
JEDEC CodeR-PQFP-N
Package QTY3000
CarrierLARGE T&R
Device MarkingWT774
Width (mm)3.5
Length (mm)4
Thickness (mm).9
Pitch (mm).5
Max Height (mm)1
Mechanical DataHerunterladen

Parameter

Bits4
F @ Nom Voltage(Max)100 Mhz
ICC @ Nom Voltage(Max)0.016 mA
Operating Temperature Range-40 to 85 C
Package GroupVQFN
Package Size: mm2:W x L16VQFN: 14 mm2: 3.5 x 4(VQFN) PKG
RatingCatalog
Schmitt TriggerNo
Technology FamilyAVC
VCC(Max)3.6 V
VCC(Min)1.2 V
Voltage(Nom)1.2,1.5,1.8,2.5,3.3 V
tpd @ Nom Voltage(Max)3.5,3.1,2.8,2.6,2.5 ns

Öko-Plan

RoHSCompliant

Design Kits und Evaluierungsmodule

  • Evaluation Modules & Boards: TAS2557EVM
    TAS2557 5.7-W Class-D Audio Amplifier Evaluation Module with Class-H Boost and Speaker Sense
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: BOOST-CC2564MODA
    Dual-mode BluetoothВ® CC2564 module with integrated antenna BoosterPackВ™ plug-in module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: CC256XQFNEM
    Dual-mode BluetoothВ® CC2564 evaluation board
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: CC2564MODNEM
    Dual-mode BluetoothВ® CC2564 module evaluation board
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: CC2564MODAEM
    Dual-mode BluetoothВ® CC2564 Module with Integrated Antenna Evaluation Board
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TAS2560EVM
    TAS2560 5.6W Class-D Audio Amplifier Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TAS2559EVM
    TAS2559 5.7-W Class-D Audio Amplifier Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: DLPDLCR4710EVM-G2
    Full HD DLP4710 Chipset Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)

Anwendungshinweise

  • Dynamic Output Control (DOC) Circuitry Technology And Applications (Rev. B)
    PDF, 126 Kb, Revision: B, Datei veröffentlicht: Jul 7, 1999
    Texas Instruments (TI[TM]) next-generation logic is called the Advanced Very-low-voltage CMOS (AVC) family. The AVCfamily features TI?s Dynamic Output Control (DOC[TM]) circuit (patent pending). DOC circuitry automatically lowers the outputimpedance of the circuit at the beginning of a signal transition, providing enough current to achieve high signaling speeds, thensubsequently raises the i
  • AVC Logic Family Technology and Applications (Rev. A)
    PDF, 148 Kb, Revision: A, Datei veröffentlicht: Aug 26, 1998
    Texas Instruments (TI?) announces the industry?s first logic family to achieve maximum propagation delays of less than 2 ns at 2.5 V. TI?s next-generation logic is the Advanced Very-low-voltage CMOS (AVC) family. Although optimized for 2.5-V systems, AVC logic supports mixed-voltage systems because it is compatible with 3.3-V and 1.8-V devices. The AVC family features TI?s Dynamic Output Control (
  • Voltage Translation Between 3.3-V, 2.5-V, 1.8-V, and 1.5-V Logic Standards (Rev. B)
    PDF, 390 Kb, Revision: B, Datei veröffentlicht: Apr 30, 2015
  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
    PDF, 895 Kb, Revision: B, Datei veröffentlicht: May 22, 2002
    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
  • Selecting the Right Level Translation Solution (Rev. A)
    PDF, 313 Kb, Revision: A, Datei veröffentlicht: Jun 22, 2004
    Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati

Modellreihe

Herstellerklassifikation

  • Semiconductors > Logic > Voltage Level Translation > Direction Controlled Voltage Translation