Datasheet Texas Instruments AM26LV32CDG4 — Datenblatt
| Hersteller | Texas Instruments |
| Serie | AM26LV32 |
| Artikelnummer | AM26LV32CDG4 |
Niederspannungs-Hochgeschwindigkeits-Vierfach-Differenzleitungsempfänger 16-SOIC 0 bis 70
Datenblätter
AM26LV32 Low-Voltage, High-Speed Quadruple Differential Line Receiver datasheet
PDF, 1.0 Mb, Revision: F, Datei veröffentlicht: Nov 18, 2016
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Preise
Status
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | Yes |
Verpackung
| Pin | 16 |
| Package Type | D |
| Industry STD Term | SOIC |
| JEDEC Code | R-PDSO-G |
| Package QTY | 40 |
| Carrier | TUBE |
| Device Marking | AM26LV32C |
| Width (mm) | 3.91 |
| Length (mm) | 9.9 |
| Thickness (mm) | 1.58 |
| Pitch (mm) | 1.27 |
| Max Height (mm) | 1.75 |
| Mechanical Data | Herunterladen |
Parameter
| ICC(Max) | 17 mA |
| Operating Temperature Range | -40 to 85,0 to 70 C |
| Package Group | SOIC |
| Rating | Catalog |
| Signaling Rate | 32 Mbps |
| Supply Voltage(s) | 3.3 V |
Öko-Plan
| RoHS | Compliant |
Anwendungshinweise
- Wave Solder Exposure of SMT PackagesPDF, 206 Kb, Datei veröffentlicht: Sep 9, 2008
It is common practice to attach surface mount components to the underside of a printed circuit board (PCB) by processing the PCB through a wave soldering operation after gluing the components to the PCB. This paper ummarizes results of several tests performed to understand the performance of surface mount components when exposed to the conditions outlined in JESD22A111.
Modellreihe
Serie: AM26LV32 (17)
Herstellerklassifikation
- Semiconductors > Interface > RS-485/RS-422