Datasheet Texas Instruments TPS79318YZQT — Datenblatt
Hersteller | Texas Instruments |
Serie | TPS793 |
Artikelnummer | TPS79318YZQT |
Hohe PSRR, rauscharm, 200 mA LDO mit Einzelausgang, 5-DSBGA -40 bis 125
Datenblätter
TPS793 Low-Noise, High PSRR, RF, 200-mA Low-Dropout Linear Regulators in NanoStarв„ў Wafer Chip Scale and SOT-23 datasheet
PDF, 1.2 Mb, Revision: L, Datei veröffentlicht: Aug 7, 2014
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Preise
Status
Lifecycle Status | Active (Recommended for new designs) |
Manufacture's Sample Availability | No |
Verpackung
Pin | 5 |
Package Type | YZQ |
Industry STD Term | DSBGA |
JEDEC Code | R-XBGA-N |
Package QTY | 250 |
Carrier | SMALL T&R |
Device Marking | E3 |
Thickness (mm) | .45 |
Pitch (mm) | .5 |
Max Height (mm) | .6 |
Mechanical Data | Herunterladen |
Parameter
Accuracy | 2 % |
Fixed Output Options | 1.8,2.5,2.8,2.85,3,3.3,4.75 V |
Iout(Max) | 0.2 A |
Iq(Typ) | 0.17 mA |
Noise | 32 uVrms |
Operating Temperature Range | -40 to 125 C |
Output Capacitor Type | Ceramic |
Output Options | Adjustable Output,Fixed Output |
PSRR @ 100KHz | 44 dB |
Package Group | DSBGA |
Package Size: mm2:W x L | See datasheet (DSBGA) PKG |
Rating | Catalog |
Regulated Outputs | 1 |
Special Features | Enable |
Thermal Resistance ОёJA | 178 В°C/W |
Vdo(Typ) | 112 mV |
Vin(Max) | 5.5 V |
Vin(Min) | 2.7 V |
Vout(Max) | 5.4 V |
Vout(Min) | 1.22 V |
Öko-Plan
RoHS | Compliant |
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Anwendungshinweise
- NanoStarв„ў Wafer Chip-Scale Package Design GuidePDF, 286 Kb, Datei veröffentlicht: Sep 5, 2003
To satisfy market demand for an ultra-small, staggered 5-ball wafer-level chip-scale package, TI has introduced the 170Ојm NanoStar YEQ package. Since staggered ball WCSPs are not registered under the JEDEC MO-211 standard, there are no formal industry-standard guidelines on proper use of devices in this package. This application note gives guidelines for reliable, high-performance use of the YE - NanoStarв„ў & NanoFreeв„ў 300Ојm Solder Bump WCSP ApplicationPDF, 749 Kb, Datei veröffentlicht: Feb 2, 2004
The NanoStarв„ў Wafer Chip-Scale Package (WCSP) is a family of bare die packages developed for applications that require the smallest possible package. WCSP provides electrical interconnection via solder spheres attached to the die and is aligned with JEDEC package standard MOв€’211. NanoStarв„ў, with advanced materials engineering technology, has demonstrated excellent board level rel - Cycloneв„ў III FPGA Starter Kit Power Reference DesignPDF, 314 Kb, Datei veröffentlicht: Mar 27, 2008
This power supply was designed to power the 3C25F324 starter kit. This reference design has many benefits over the existing power supply found on the starter kit demonstration board.
Modellreihe
Serie: TPS793 (34)
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Herstellerklassifikation
- Semiconductors > Power Management > Linear Regulator (LDO) > Single Channel LDO