Datasheet Texas Instruments TS3USB3000RLSR — Datenblatt

DPDT USB 2.0 Hochgeschwindigkeits- und mobiler High-Definition-Link (MHL) (6,1 GHz) Switch 10-UQFN -40 auf 85

Datenblätter

PDF, 2.0 Mb, Revision: C, Datei veröffentlicht: Jan 10, 2017

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Lifecycle Status	Preview (Device has been announced but is not in production. Samples may or may not be available)
Manufacture's Sample Availability	No

Additional Features	USB 2.0 Mobile High-Definition Link (MHL) Over-Voltage Tolerance (OVT) Current Leakage Protection Logic Controlled (Output Enabled)
Approx. Price (US$)	0.35 \| 1ku
Bandwidth(MHz)	6100
Configuration	1:2 SPDT
Crosstalk(Typ)(dB)	-37
ESD Charged Device Model(Typ)(kV)	1
ESD HBM(Typ)(kV)	3.5
ICC(Max)(uA)	50
ICC(Typ)(uA)	30
Input/Ouput Voltage(Max)(V)	3.6
Input/Output OFF-state Capacitance(Typ)(pF)	1.6
Input/Output ON-state Capacitance(Typ)(pF)	1.4
Number of Channels(#)	2
OFF-state leakage current(Max)(ВµA)	2
ON-state resistance flatness(Typ)(в„¦)	1
Off Isolation(Typ)(dB)	-34
Operating Temperature Range(C)	-40 to 85
Package Group	UQFN
Package Size: mm2:W x L (PKG)	10UQFN: 3 mm2: 2 x 1.5(UQFN)
Powered-off leakage current(Max)(ВµA)	10
Powered-on leakage current(Max)(ВµA)	2
Propagation Delay(Typ)(ns)	0.1
Rating	Catalog
Ron Channel Match(Typ)(в„¦)	0.1
Ron(Max)(Ohms)	7.5
Ron(Typ)(Ohms)	4.6
Turn off Time (Disable)(Max)(ns)	400
Turn on Time (Enable)(Max)(ns)	400
VCC(Max)(V)	4.3
VCC(Min)(V)	2.7

RoHS	TBD
Pb Free	No

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High-Speed Interface Layout Guidelines (Rev. G)
PDF, 814 Kb, Revision: G, Datei veröffentlicht: Jul 27, 2017
As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

Serie: TS3USB3000 (3)