Datasheet Texas Instruments 74ALVTH32374ZKER — Datenblatt

HerstellerTexas Instruments
SerieSN74ALVTH32374
Artikelnummer74ALVTH32374ZKER
Datasheet Texas Instruments 74ALVTH32374ZKER

2,5-V / 3,3-V-32-Bit-Flip-Flops vom Typ D-Typ mit 3-Zustands-Ausgängen 96-LFBGA -40 bis 85

Datenblätter

2.5-V/3.3-V 32-Bit Edge-Triggered D-Type Flip-Flops With 3-State Outputs datasheet
PDF, 884 Kb, Datei veröffentlicht: Sep 3, 1999
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Preise

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

Verpackung

Pin96
Package TypeZKE
Industry STD TermBGA MICROSTAR
JEDEC CodeR-PBGA-N
Package QTY1000
CarrierLARGE T&R
Device MarkingVL374
Width (mm)5.5
Length (mm)13.5
Thickness (mm).85
Pitch (mm).8
Max Height (mm)1.4
Mechanical DataHerunterladen

Öko-Plan

RoHSCompliant

Anwendungshinweise

  • Advanced Low-Voltage Technology
    PDF, 59 Kb, Datei veröffentlicht: Jul 27, 1999
    ALVT, the advanced low-voltage logic family, offers high-performance BiCMOS devices that are functional at 3.3-V and 2.5-V V sub CC and have low propagation delay, low static-power consumption, and 64 mA current drive. Other features include 5-V tolerance; auto3-state; bus hold; partial power down, hot insertion, and live insertion; and excellent simultaneous-switching and output-skew performance.
  • Bus-Hold Circuit
    PDF, 418 Kb, Datei veröffentlicht: Feb 5, 2001
    When designing systems that include CMOS devices, designers must pay special attention to the operating condition in which all of the bus drivers are in an inactive, high-impedance condition (3-state). Unless special measures are taken, this condition can lead to undefined levels and, thus, to a significant increase in the device?s power dissipation. In extreme cases, this leads to oscillation of
  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
    PDF, 895 Kb, Revision: B, Datei veröffentlicht: May 22, 2002
    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
  • Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A)
    PDF, 154 Kb, Revision: A, Datei veröffentlicht: Sep 8, 1999
    In the last few years the trend toward reducing supply voltage (VCC) has continued as reflected in an additional specification of 2.5-V VCC for the AVC ALVT ALVC LVC LV and the CBTLV families.In this application report the different logic levels at VCC of 5 V 3.3 V 2.5 V and 1.8 V are compared. Within the report the possibilities for migration from 5-V logic and 3.3-V logic families
  • Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
    PDF, 209 Kb, Datei veröffentlicht: May 10, 2002
    Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, Datei veröffentlicht: Aug 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con

Modellreihe

Serie: SN74ALVTH32374 (2)

Herstellerklassifikation

  • Semiconductors > Logic > Flip-Flop/Latch/Register > D-Type Flip-Flop