Datasheet Texas Instruments 5962-9759301Q2A — Datenblatt

HerstellerTexas Instruments
SerieSN54F04
Artikelnummer5962-9759301Q2A
Datasheet Texas Instruments 5962-9759301Q2A

Hex-Wechselrichter 20-LCCC -55 bis 125

Datenblätter

Hex Inverters datasheet
PDF, 1.1 Mb, Revision: A, Datei veröffentlicht: Oct 1, 1993
Auszug aus dem Dokument

Preise

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

Verpackung

Pin20202020
Package TypeFKFKFKFK
Industry STD TermLCCCLCCCLCCCLCCC
JEDEC CodeS-CQCC-NS-CQCC-NS-CQCC-NS-CQCC-N
Package QTY1111
CarrierTUBETUBETUBETUBE
Device Marking9759301Q2ASNJ54F5962-04FK
Width (mm)8.898.898.898.89
Length (mm)8.898.898.898.89
Thickness (mm)1.831.831.831.83
Pitch (mm)1.271.271.271.27
Max Height (mm)2.032.032.032.03
Mechanical DataHerunterladenHerunterladenHerunterladenHerunterladen

Parameter

Bits6
Input TypeTTL
Operating Temperature Range-55 to 125 C
Output TypeTTL
Package GroupLCCC
Package Size: mm2:W x L20LCCC: 79 mm2: 8.89 x 8.89(LCCC) PKG
RatingMilitary
Schmitt TriggerNo
Technology FamilyF
VCC(Max)5.5 V
VCC(Min)4.5 V
Voltage(Nom)5 V

Öko-Plan

RoHSSee ti.com

Anwendungshinweise

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  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, Datei veröffentlicht: Aug 29, 2002
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  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Kb, Revision: A, Datei veröffentlicht: Aug 1, 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
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  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, Datei veröffentlicht: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, Revision: C, Datei veröffentlicht: Jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Introduction to Logic
    PDF, 93 Kb, Datei veröffentlicht: Apr 30, 2015

Modellreihe

Herstellerklassifikation

  • Semiconductors > Space & High Reliability > Logic Products > Buffers/Drivers/Transceivers > Buffer Drivers

Andere Namen:

59629759301Q2A, 5962 9759301Q2A