Datasheet Texas Instruments SN74CB3Q3245GQNR — Datenblatt
Hersteller | Texas Instruments |
Serie | SN74CB3Q3245 |
Artikelnummer | SN74CB3Q3245GQNR |
Datenblätter
SN74CB3Q3245 datasheet
PDF, 1.1 Mb, Revision: B, Datei veröffentlicht: Nov 20, 2003
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Preise
Status
Lifecycle Status | Obsolete (Manufacturer has discontinued the production of the device) |
Manufacture's Sample Availability | No |
Verpackung
Pin | 20 |
Package Type | GQN |
Industry STD Term | BGA MICROSTAR JUNIOR |
JEDEC Code | R-PBGA-N |
Width (mm) | 3 |
Length (mm) | 4 |
Thickness (mm) | .75 |
Pitch (mm) | .65 |
Max Height (mm) | 1 |
Mechanical Data | Herunterladen |
Ersatz
Replacement | SN74CB3Q3245ZQNR |
Replacement Code | P |
Parameter
Additional Features | IOFF |
Approx. Price (US$) | 0.33 | 1ku |
Bandwidth(MHz) | 500 |
Configuration | SPST |
ESD Charged Device Model(kV) | 1 |
ESD HBM(kV) | 2 |
ICC(Max)(uA) | 2000 |
Input/Ouput Voltage(Max)(V) | 5.5 |
Input/Output Continuous Current(Max)(mA) | 64 |
Number of Channels(#) | 8 |
Operating Temperature Range(C) | -40 to 85 |
Package Group | BGA MICROSTAR JUNIOR SSOP TSSOP TVSOP VQFN |
Package Size: mm2:W x L (PKG) | 20BGA MICROSTAR JUNIOR: 12 mm2: 3 x 4(BGA MICROSTAR JUNIOR) 20VQFN: 16 mm2: 3.5 x 4.5(VQFN) 20TVSOP: 32 mm2: 6.4 x 5(TVSOP) 20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP) 20SSOP: 52 mm2: 6 x 8.65(SSOP) |
Rating | Catalog |
Ron(Max)(Ohms) | 9 |
Ron(Typ)(Ohms) | 4.5 |
VCC(Max)(V) | 3.6 |
VCC(Min)(V) | 2.3 |
Öko-Plan
RoHS | Not Compliant |
Pb Free | No |
Anwendungshinweise
- CBT-C, CB3T, and CB3Q Signal-Switch FamiliesPDF, 584 Kb, Datei veröffentlicht: Feb 4, 2003
Signal switch devices are widely used in applications requiring bus isolation, multiplexing, demultiplexing, and voltage translation. Compared to other logic and linear product alternatives, signal switches are the fastest and least power consuming. Texas Instruments (TI) CBT-C, CB3Q, and CB3T signal-switch families have low on-state resistance, negligible power consumption, and better undershoot - Bus FET Switch Solutions for Live Insertion ApplicationsPDF, 300 Kb, Datei veröffentlicht: Feb 7, 2003
In today?s competitive computing and networking industry, any equipment downtime due to component interconnects or bus failures impedes communication, hinders productivity and hampers financial growth. In recognizing this increasingly costly unplanned downtime, the industry introduced live-insertion technology to minimize the impact of any such failures. The live-insertion feature enables a networ
Modellreihe
Serie: SN74CB3Q3245 (11)
Herstellerklassifikation
- Semiconductors > Switches and Multiplexers > Signal Switches > Digital Switch