Datasheet Texas Instruments TPS56221DQPT — Datenblatt

HerstellerTexas Instruments
SerieTPS56221
ArtikelnummerTPS56221DQPT
Datasheet Texas Instruments TPS56221DQPT

4,5 V bis 14 V Eingang, 25 A synchroner SWIFT ™ -Konverter 22-LSON-CLIP -40 bis 125

Datenblätter

TPS56221 4.5-V to 14-V Input, High-Current, Synchronous Buck SWIFTв„ў Converter datasheet
PDF, 1.3 Mb, Revision: D, Datei veröffentlicht: Feb 9, 2016
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Preise

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityYes

Verpackung

Pin22
Package TypeDQP
Industry STD TermLSON-CLIP
JEDEC CodeR-PSSO-N
Package QTY250
CarrierSMALL T&R
Device MarkingTPS56221
Width (mm)5
Length (mm)6
Thickness (mm)1.5
Pitch (mm).5
Max Height (mm)1.5
Mechanical DataHerunterladen

Parameter

Control ModeVoltage Mode
Duty Cycle(Max)93 %
Iout(Max)25 A
Iq(Typ)2.5 mA
Operating Temperature Range-40 to 125 C
Package GroupLSON-CLIP
RatingCatalog
Regulated Outputs1
Special FeaturesEnable,Light Load Efficiency,Pre-Bias Start-Up,Synchronous Rectification
Switching Frequency(Max)1000 kHz
Switching Frequency(Min)300 kHz
TypeConverter
Vin(Max)14 V
Vin(Min)4.5 V
Vout(Max)12 V
Vout(Min)0.6 V

Öko-Plan

RoHSCompliant
Pb FreeYes

Design Kits und Evaluierungsmodule

  • Evaluation Modules & Boards: TPS56221EVM-579
    Evaluation Module for TPS56221 High Current (25A) Synchronous Step-Down SWIFTВ™ Converter
    Lifecycle Status: Active (Recommended for new designs)

Anwendungshinweise

  • PowerStackв„ў Packaging Technology Overview
    PDF, 515 Kb, Datei veröffentlicht: Jul 18, 2011
  • Calculating Efficiency
    PDF, 175 Kb, Datei veröffentlicht: Feb 19, 2010
    This application report provides a step-by-step procedure for calculating buck converter efficiency and power dissipation at operating points not provided by the data sheet.
  • Demystifying Type II and Type III Compensators Using Op-Amp and OTA for DC/DC Co
    PDF, 782 Kb, Datei veröffentlicht: Jul 11, 2014
  • Understanding Thermal Dissipation and Design of a Heatsink
    PDF, 59 Kb, Datei veröffentlicht: May 4, 2011
    Power dissipation performance must be well understood prior to integrating devices on a printed-circuit board (PCB) to ensure that any given device is operated within its defined temperature limits. When a device is running, it consumes electrical energy that is transformed into heat. Most of the heat is typically generated by switching devices like MOSFETs, ICs, etc. This application report discu
  • Semiconductor and IC Package Thermal Metrics (Rev. C)
    PDF, 201 Kb, Revision: C, Datei veröffentlicht: Apr 19, 2016

Modellreihe

Serie: TPS56221 (2)

Herstellerklassifikation

  • Semiconductors > Power Management > Non-isolated DC/DC Switching Regulator > Step-Down (Buck) > Buck Converter (Integrated Switch)