Datasheet Texas Instruments LM22673QMR-5.0/NOPB — Datenblatt
| Hersteller | Texas Instruments |
| Serie | LM22673-Q1 |
| Artikelnummer | LM22673QMR-5.0/NOPB |
3A SIMPLE SWITCHER®, Step-Down Voltage Reg.
Datenblätter
LM22673/-Q1 42 V, 3 A SIMPLE SWITCHERВ®, Step-Down Voltage Regulator with Features datasheet
PDF, 1.6 Mb, Revision: O, Datei veröffentlicht: Nov 5, 2014
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Preise
Detaillierte Beschreibung
mit einstellbarem Softstart und Strombegrenzung 8-SO PowerPAD -40 bis 125
Status
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | Yes |
Verpackung
| Pin | 8 | 8 |
| Package Type | DDA | DDA |
| Industry STD Term | HSOIC | HSOIC |
| JEDEC Code | R-PDSO-G | R-PDSO-G |
| Package QTY | 95 | 95 |
| Carrier | TUBE | TUBE |
| Device Marking | L22673 | Q-5.0 |
| Width (mm) | 3.9 | 3.9 |
| Length (mm) | 4.89 | 4.89 |
| Thickness (mm) | 1.48 | 1.48 |
| Pitch (mm) | 1.27 | 1.27 |
| Max Height (mm) | 1.7 | 1.7 |
| Mechanical Data | Herunterladen | Herunterladen |
Parameter
| Control Mode | Voltage Mode |
| Duty Cycle(Max) | 90 % |
| Iout(Max) | 3 A |
| Iq(Typ) | 3.4 mA |
| Operating Temperature Range | -40 to 125 C |
| Package Group | SO PowerPAD |
| Rating | Automotive |
| Regulated Outputs | 1 |
| Special Features | Enable |
| Switching Frequency(Max) | 500 kHz |
| Switching Frequency(Min) | 500 kHz |
| Type | Converter |
| Vin(Max) | 42 V |
| Vin(Min) | 4.5 V |
| Vout(Max) | 37 V |
| Vout(Min) | 1.285 V |
Öko-Plan
| RoHS | Compliant |
Anwendungshinweise
- AN-643 EMI/RFI Board Design (Rev. B)PDF, 742 Kb, Revision: B, Datei veröffentlicht: May 3, 2004
Application Note 643 EMI/RFI Board Design - AN-1533 Overvoltage Protection Circuit for Automotive Load Dump (Rev. B)PDF, 83 Kb, Revision: B, Datei veröffentlicht: May 6, 2013
This application report discusses an over voltage protection circuit for automotive load dump. - Input and Output Capacitor SelectionPDF, 219 Kb, Datei veröffentlicht: Sep 19, 2005
- AN-1197 Selecting Inductors for Buck Converters (Rev. B)PDF, 558 Kb, Revision: B, Datei veröffentlicht: Apr 23, 2013
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This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor. - AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)PDF, 1.4 Mb, Revision: A, Datei veröffentlicht: Apr 23, 2013
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This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time. - Semiconductor and IC Package Thermal Metrics (Rev. C)PDF, 201 Kb, Revision: C, Datei veröffentlicht: Apr 19, 2016
- AN-1797 TO-263 THIN Package (Rev. A)PDF, 2.3 Mb, Revision: A, Datei veröffentlicht: Apr 24, 2013
This application note describes the TO–263 THIN Package. - AN-2020 Thermal Design By Insight, Not Hindsight (Rev. C)PDF, 568 Kb, Revision: C, Datei veröffentlicht: Apr 23, 2013
This application report provides an in-depth discussion of thermal design. - AN-1997 Error Amplifier Limitations in High-Performance Regulator Applications (Rev. A)PDF, 153 Kb, Revision: A, Datei veröffentlicht: May 6, 2013
The development of realistic predictions to assist the power supply engineer during the control loop design process is facilitated in this application report by appropriate small-signal and bode plot analysis, the validity of which is verified through simulation results. - SIMPLE SWITCHER Regulators Take Over Automotive Applications (Rev. A)PDF, 72 Kb, Revision: A, Datei veröffentlicht: Apr 23, 2013
Power management applications, typically located on the front line of the automotive electronics system,can be subject to wide input operating voltage extremes resulting from load-dump and cold-crankingconditions. Careful selection of the power management electronics can provide added margin andprotection to the automotive electronics system. The simplest design is provided by a power manage - Low EMI Layout Made SIMPLE With LM43600/1/2/3 and LM46000/1/2 (Rev. A)PDF, 512 Kb, Revision: A, Datei veröffentlicht: Sep 12, 2014
Printed Circuit Board (PCB) layout for Switched Mode Power Supplies (SMPS) is critical to achieve proper converter operation good thermal performance and excellent radiated EMI performance. Optimized board layout for low radiated EMI is made very simple by the package and pin arrangement of the SIMPLE SWITCHER Synchronous Buck Converter family LM4360x and LM4600x - AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)PDF, 82 Kb, Revision: C, Datei veröffentlicht: Apr 23, 2013
When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current - AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)PDF, 374 Kb, Revision: C, Datei veröffentlicht: Apr 23, 2013
This application report provides SIMPLE SWITCHER™ PCB layout guidelines. - AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)PDF, 2.5 Mb, Revision: C, Datei veröffentlicht: Apr 24, 2013
Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti - AN-1246 Stresses in Wide Input DC-DC Converters (Rev. C)PDF, 427 Kb, Revision: C, Datei veröffentlicht: Apr 23, 2013
This application note discusses stresses in wide input DC-DC converters. - AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)PDF, 9.2 Mb, Revision: B, Datei veröffentlicht: Apr 23, 2013
This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
Modellreihe
Serie: LM22673-Q1 (10)
Herstellerklassifikation
- Semiconductors > Power Management > Non-isolated DC/DC Switching Regulator > Step-Down (Buck) > Buck Converter (Integrated Switch)
Andere Namen:
LM22673QMR5.0/NOPB, LM22673QMR 5.0/NOPB