Datasheet Texas Instruments V62/12605-01XE — Datenblatt
| Hersteller | Texas Instruments |
| Serie | OMAPL138B-EP |
| Artikelnummer | V62/12605-01XE |
Verbesserter Prozessor für Anwendungen mit geringem Stromverbrauch 361-NFBGA -55 bis 125
Datenblätter
OMAPL138B-EP C6000 DSP+ARMВ® Processor datasheet
PDF, 1.8 Mb, Revision: C, Datei veröffentlicht: Apr 12, 2013
Auszug aus dem Dokument
Preise
Status
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | Yes |
Verpackung
| Pin | 361 | 361 | 361 |
| Package Type | GWT | GWT | GWT |
| Industry STD Term | NFBGA | NFBGA | NFBGA |
| JEDEC Code | S-PBGA-N | S-PBGA-N | S-PBGA-N |
| Package QTY | 90 | 90 | 90 |
| Carrier | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) |
| Device Marking | GWTMEP | OMAPL138B | 21 |
| Width (mm) | 16 | 16 | 16 |
| Length (mm) | 16 | 16 | 16 |
| Thickness (mm) | .9 | .9 | .9 |
| Pitch (mm) | .8 | .8 | .8 |
| Max Height (mm) | 1.4 | 1.4 | 1.4 |
| Mechanical Data | Herunterladen | Herunterladen | Herunterladen |
Parameter
| ARM CPU | 1 ARM9 |
| ARM MHz | 345 Max. |
| Applications | Communications and Telecom,Energy,Industrial,Medical |
| DRAM | LPDDR,DDR2 |
| DSP | 1 C674x |
| DSP MHz | 345 Max. |
| Display Options | 1 |
| EMAC | 10/100 |
| I2C | 2 |
| On-Chip L2 Cache | 256 KB (DSP) |
| Operating Systems | Linux,SYS/BIOS |
| Operating Temperature Range | -55 to 125 C |
| Other On-Chip Memory | 128 KB |
| Rating | HiRel Enhanced Product |
| SPI | 2 |
| UART | 3 SCI |
| USB | 2 |
| Video Port | 1 Configurable |
Öko-Plan
| RoHS | See ti.com |
Design Kits und Evaluierungsmodule
- JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
XDS560v2 System Trace USB Debug Probe
Lifecycle Status: Active (Recommended for new designs) - JTAG Emulators/ Analyzers: TMDSEMU200-U
XDS200 USB Debug Probe
Lifecycle Status: Active (Recommended for new designs) - JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
XDS560v2 System Trace USB & Ethernet Debug Probe
Lifecycle Status: Active (Recommended for new designs)
Anwendungshinweise
- Plastic Ball Grid Array [PBGA] Application Note (Rev. B)PDF, 1.6 Mb, Revision: B, Datei veröffentlicht: Aug 13, 2015
- nFBGA Packaging (Rev. B)PDF, 3.1 Mb, Revision: B, Datei veröffentlicht: Nov 13, 2015
This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts. - Processor SDK RTOS Audio Benchmark Starter KitPDF, 530 Kb, Datei veröffentlicht: Apr 12, 2017
The TI TMS320C6000в„ў Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications that are commonly used in audio processing application. This application notes describes Audio Benchmark Starterkit software that is intended to provide an easy and quick way to benchmark key audio functions on C66x and C674x DSP device - 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)PDF, 40.5 Mb, Revision: A, Datei veröffentlicht: Aug 9, 2015
Modellreihe
Serie: OMAPL138B-EP (2)
- OMAPL138BGWTMEP V62/12605-01XE
Herstellerklassifikation
- Semiconductors > Space & High Reliability > Processor > Digital Signal Processor > C6000 DSP + ARM Processor
Andere Namen:
V62/1260501XE, V62/12605 01XE