Datasheet Texas Instruments TLE2426MDREP — Datenblatt
| Hersteller | Texas Instruments |
| Serie | TLE2426-EP |
| Artikelnummer | TLE2426MDREP |
Verbesserte virtuelle Erdung für Produktschienen-Splitter-Präzision 8-SOIC -55 bis 125
Datenblätter
The Rail Splitter Precision Virtual Ground datasheet
PDF, 758 Kb, Datei veröffentlicht: Mar 20, 2006
Auszug aus dem Dokument
Preise
Status
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No |
Verpackung
| Pin | 8 |
| Package Type | D |
| Industry STD Term | SOIC |
| JEDEC Code | R-PDSO-G |
| Package QTY | 2500 |
| Carrier | LARGE T&R |
| Device Marking | 2426EP |
| Width (mm) | 3.91 |
| Length (mm) | 4.9 |
| Thickness (mm) | 1.58 |
| Pitch (mm) | 1.27 |
| Max Height (mm) | 1.75 |
| Mechanical Data | Herunterladen |
Parameter
| Operating Temperature Range | -55 to 125 C |
| Package Group | SOIC |
| Package Size: mm2:W x L | 8SOIC: 29 mm2: 6 x 4.9(SOIC) PKG |
| Pin/Package | 8SOIC |
| Rating | HiRel Enhanced Product |
Öko-Plan
| RoHS | Compliant |
Modellreihe
Serie: TLE2426-EP (2)
- TLE2426MDREP V62/06601-01XE
Herstellerklassifikation
- Semiconductors > Space & High Reliability > Special Function