Datasheet US1D - Multicomp DIODE, ULTRA-FAST, 1 A, 200 V — Datenblatt

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Manufacturer: Multicomp

Description: DIODE, ULTRA-FAST, 1 A, 200 V

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Docket:
US1x Series
Features:
· · · · · · · · · · Glass passivated junction chip.

For surface mounted application. Low profile package. Built-in strain relief. Ideal for automated placement. Easy pick and place. Ultrafast recovery time for high efficiency. Low forward voltage, low power loss. High temperature soldering guaranteed: 260oC/10 seconds on terminals. Plastic material.
SMB/DO-214AC
Dimensions : Inches (Millimetres)

Specifications:

• Current Ifsm: 30 A
• Diode Configuration: Single
• Diode Type: Fast Recovery
• External Depth: 2.50 mm
• External Length / Height: 2.83 mm
• External Width: 4.6 mm
• Forward Current If Max: 1 A
• Forward Current If(AV): 1 A
• Forward Surge Current Ifsm Max: 30 A
• Forward Voltage VF Max: 1 V
• Forward Voltage: 1 V
• Junction Temperature Tj Max: 150°C
• Junction Temperature Tj Min: -55°C
• Junction to Case Thermal Resistance A: 75 °C/W
• Mounting Type: SMD
• Number of Pins: 2
• Operating Temperature Range: -55°C to +150°C
• Package / Case: DO-214AC
• Repetitive Reverse Voltage Vrrm Max: 200 V
• Reverse Recovery Time trr Max: 50 ns
• RoHS: Yes
• SVHC: No SVHC (19-Dec-2011)